Testing Service - BGA/CSP
BGA/CSP/QFP Testing
Atometron offers high-level electrical testing of your BGA/CSP/QFP devices.
-Quick turn
- Insurance policy against defective and/or counterfeit devices
- Ensures electrical package integrity through the PCB or ceramic substrate, IC interconnects (wirebonding or flip chip), and the IC traces
- Proven methods developed during original BGA/CSP development
- Validates I/O connections
- Wide range of device fixturing and test equipment
- Pitches of 0.5, 0.65, 0.8, 1.0, and 1.27mm
- Vss to Vdd/Vcc isolation
- JTAG powerup, Die ID, and logic check
- Authenticity analysis against counterfeit
Caution: High MSL rated devices (i.e. levels 3-5 per IPC/JEDEC J-STD-020C) are highly susceptible to package integrity defects
Comprehensive Test Report
- Full device and work order logging
- Yield % for Opens and Shorts
- Photographic record of devices
- Pin-out map of device
Atometron offers a variety of Destructive and Non-Destructive Testing and Analysis
- X-Ray, 2-D
- C-SAM (Accoustical Microscopy)
- Dye Penetrant
- Decapsulation, die inspect
- XRF Spectroscopy - RoHS verification
- Visual Inspection (workmanship)
- Solderability per IPC
- Expert Counterfeit Analysis
Simply enter the details of the device and desired test(s) for an expedient quote
